Solid electrolytic capacitor and method for producing solid electrolytic capacitor

ABSTRACT

A solid electrolytic capacitor element having a solid electrolyte layer provided on a dielectric layer formed on a surface of an anode body comprising a valve acting metal including a pore, wherein the anode body is configured in such a way that multiple plate-shaped anode bodies are directly piled and integrated with a solid electrolyte, and adjacent piled anode bodies are joined at a section thereof, and a method for producing the solid electrolytic capacitor element.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a solid electrolytic capacitor using aconductive polymer as a solid electrolyte layer, and a method forproducing the solid electrolytic capacitor. More specifically, thepresent invention relates to a solid electrolytic capacitor which has ahigh capacitance per unit volume, and a method for producing the solidelectrolytic capacitor.

2. Description of the Related Art

Solid electrolytic capacitors are configured typically in such a waythat the surface of an anode body composed of a valve acting metal suchas aluminum, tantalum, niobium, titanium, and alloys thereof isroughened by etching to form micropores on the order of microns and thusincrease the surface area, a dielectric oxide film (hereinafter, whichmay be simply referred to as a dielectric film) is formed thereon by achemical conversion step, a cathode section is further impregnated witha solid electrolyte with a separator composed of an insulating resininterposed between the cathode section and an anode section, a cathodeconductive layer composed of a carbon paste and a metal containingconductive paste is formed thereon and then connected to a lead frame toserve as an external electrode terminal, and a resin exterior is formedwith the use of an epoxy resin or the like.

Solid electrolytic capacitors using a conductive polymer as a solidelectrolyte have been widely used as backup power sources for CPUs forcontrolling personal computers, because the solid electrolyticcapacitors are capable of reducing the equivalent series resistance(ESR) and the leak current, as compared with solid electrolyticcapacitors using manganese dioxide or the like as a solid electrolyte.The downsizing of personal computers has been progressed fromconventional desktop computers through A4-size notebook computers toB5-size notebook computers. Furthermore, netbooks released into themarket last year, which have a limited range of functions to achieveprice-reduction and pursue the portability, have been receivingoverwhelming support from the market.

Such reduction in size of main bodies of personal computers has beenalso powerfully promoting the downsizing of circuit board themselveshoused in the main bodies, and as a result, there has been demand forproducts of capacitors which have the same capacitance, a lower profile,and a smaller area, and the demand for improvement of the ratio ofcapacitance developed per volume has been increased more than ever.

The capacitance of a stack-type solid electrolytic capacitor isproportional to the number of capacitor elements housed in a chip. Thestacked capacitor elements are produced by a method of bonding theelements with a silver paste interposed therebetween for the purpose ofintegration, or a method of piling multiple sheets of cathode sectionsof elements and covering the cathode sections with a silver paste forthe purpose of integration as disclosed in Japanese Patent ApplicationLaid-Open No. 4-91418.

In order to increase the ratio of capacitance developed per volume insuch a solid electrolytic capacitor, it is necessary to contain moreelements in a specified chip volume, and the reduction in elementthickness per element is thus required for stacking more sheets ofcapacitor elements. However, in view of the thicknesses of an anode body(aluminum foil) and a lead frame which inevitably occupy the space inthe chip, the allowable thicknesses for the other components areextremely small, and it is thus becoming more and more difficult toachieve higher capacitances.

As for the thickness of a solid electrolyte layer that is a typicalcomponent other than the aluminum foil and the lead frame, a method forreducing the thickness of a solid electrolyte layer in accordance withJapanese Patent Application Laid-Open No. 2006-173593 can be given as anexample, in which a step of immersion in a solution containing nooxidizing agent, followed by drying is added to a step of immersion in asolution containing a monomer and a step of immersion in a solutioncontaining an oxidizing agent, followed by drying.

On the other hand, Japanese Patent Application Laid-Open No. 5-304059discloses a method of joining anode foil pieces (chemically convertedaluminum foil pieces) with a conductor strip interposed therebetween forthe purpose of integration, then forming a solid electrolyte layer oneach anode foil piece, and covering the whole with a conductive pastelayer to integrate the cathode section. In addition, Japanese PatentApplication Laid-Open No. 3-8313 discloses a method of stacking anodefoil pieces with a polyvinyl alcohol thin film interposed therebetweenand then forming a solid electrolyte layer in the gap generated byremoving the polyvinyl alcohol thin film dissolved in water. In each ofthe methods in these patent documents, a gap is provided between anodebodies, which will be included in the thickness of a stack of capacitorelements, and a solid electrolyte or a conductive layer is formed in thegap.

SUMMARY OF THE INVENTION

Accordingly, an object of the present invention is to solve the problemsof the prior art described above, and provide a solid electrolyticcapacitor which has an element reduced in thickness and has a higherratio of capacitance developed per unit volume, and a method forproducing the electrolytic capacitor.

In general, individual capacitor elements stacked for building up astack-type solid electrolytic capacitor are provided with a conductivepaste layer on the outer surface of a solid electrolyte covering thecapacitor element. This is because the specific resistance of a solidelectrolyte is generally larger as compared with that of a highlyconductive paste layer such as a silver paste layer, and the ESR is thuskept low along with a structure in which the current flowing through thecapacitor passes through the solid electrolyte for a period of time asshort as possible and is collected in the conductive paste layer.

However, the present inventors have found, as a result of earneststudies made by the present inventors in view of the problems, that theESR is only slightly increased even in the case of directly pilingmultiple sheets of anode bodies composed of a plate-shaped valve actingmetal including pores, joining adjacent anode bodies at a sectionthereof, and then covering the anode bodies with a solid electrolytelayer to integrate the anode bodies, although it is not known exactlywhy. Furthermore, the present inventors have found that when themultiple sheets of anode bodies are directly piled, and covered with asolid electrolyte layer for the integration of the anode bodies to buildup a capacitor element, the need for the solid electrolyte layer and theconductive layer (such as a carbon paste layer and a silver paste layer)is eliminated, which have been provided between individual anode bodyelements in conventional stack-type solid electrolytic capacitors,thereby allowing the ratio of capacitance developed per volume to beincreased, and have completed the present invention on the basis ofthese findings.

That is, the present invention relates to solid electrolytic capacitorsand methods for producing the solid electrolytic capacitor as follows.

In one aspect, the present invention provides a solid electrolyticcapacitor element having a solid electrolyte layer provided on adielectric layer formed on a surface of an anode body including a valveacting metal having a pore, wherein the anode body is configured in sucha way that multiple plate-shaped anode bodies are directly piled andintegrated with a solid electrolyte, and adjacent piled anode bodies arejoined at a section thereof.

In the solid electrolytic capacitor element, the joining is preferablycarried out by welding.

In the solid electrolytic capacitor element, the anode bodies can bejoined at an anode section which is not covered with the solidelectrolyte.

In the solid electrolytic capacitor element, the anode bodies cab alsobe joined at a cathode section which is covered with the solidelectrolyte.

In the solid electrolytic capacitor element, the area of a joint ispreferably 1 to 30% of the area of the cathode section of the piledanode bodies.

In the solid electrolytic capacitor element, adjacent anode bodies arepreferably mutually fixed at a section thereof with an insulating resininterposed therebetween.

In the solid electrolytic capacitor element, the anode body preferablyhas a thickness of 50 to 500 μm.

In the solid electrolytic capacitor element, the valve acting metal ispreferably aluminum, tantalum, niobium, titanium, zirconium, and alloysthereof.

In the solid electrolytic capacitor element, the solid electrolyte ispreferably a conductive polymer.

Another aspect of the present invention provides a method for producinga solid electrolytic capacitor element having a solid electrolyte layerprovided on a dielectric layer formed on a surface of an anode bodyincluding a valve acting metal having a pore, the method including stepsof: directly piling multiple sheets of anode bodies including aplate-shaped valve acting metal having a pore, and covering the anodebodies with a solid electrolyte while leaving section of the anodebodies as it is, thereby integrating the anode bodies; and joining atleast adjacent anode bodies at a section thereof.

In the method for producing a solid electrolytic capacitor element, thejoining is preferably carried out by welding.

In the method for producing a solid electrolytic capacitor element, thestep of covering the anode bodies with a solid electrolyte to integratethe anode bodies can be carried out before or after carrying out thestep of joining the anode bodies.

In the method for producing a solid electrolytic capacitor element, astep of mutually fixing adjacent anode bodies at a section thereof withan insulating resin interposed therebetween can be included.

In the method for producing a solid electrolytic capacitor element, thestep of covering the anode bodies with the solid electrolyte tointegrate the anode bodies can be carried out by impregnating surfacesof directly piled anode bodies and a space between the anode bodies witha raw material solution and polymerizing the raw material solution toyield a conductive polymer.

In another aspect, the present invention provides a solid electrolyticcapacitor wherein the solid electrolytic capacitor element has an anodesection and a cathode section respectively connected to an anode leadterminal and a cathode lead terminal, and the entire solid electrolyticcapacitor element has sealing with an insulating resin.

In the solid electrolytic capacitor, a plurality of solid electrolyticcapacitor elements are preferably stacked.

In another aspect, the present invention provides a method for producinga solid electrolytic capacitor, including the steps of connecting ananode lead terminal and a cathode lead terminal respectively to an anodesection and a cathode section of the solid electrolytic capacitorelement, and further subjecting the entire solid electrolytic capacitorelement to sealing with an insulating resin.

In yet another aspect, the present invention provides a method forproducing a stack-type solid electrolytic capacitor, including the stepsof stacking a plurality of the solid electrolytic capacitor elements,connecting an anode lead terminal and a cathode lead terminalrespectively to an anode section and a cathode section of the stack, andfurther subjecting the entire solid electrolytic capacitor elements tosealing with an insulating resin.

According to the present invention, an economical solid electrolyticcapacitor which has a high ratio of capacitance developed per unitvolume, and a method for producing the solid electrolytic capacitor canbe provided.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view illustrating an example of joining anodebodies and applying an insulating resin;

FIG. 2 is a schematic view illustrating another example of applying aninsulating resin in connection with FIG. 1;

FIG. 3 is a schematic view illustrating an example of mutually fixinganode bodies with the use of an insulating resin;

FIG. 4 is a schematic view illustrating an example of joining anodebodies at an anode section in connection with FIG. 3;

FIG. 5 is a schematic view illustrating a solid electrolytic capacitorelement according to Example 1 in which anode bodies are joined at acathode section;

FIG. 6 is a schematic view illustrating a solid electrolytic capacitorelement according to Example 2 in which anode bodies are joined at ananode section; and

FIG. 7 is a schematic view illustrating a solid electrolytic capacitorelement according to Example 4 in which anode bodies are joined at ananode section and a cathode section.

DETAILED DESCRIPTION OF THE INVENTION

A solid electrolytic capacitor and a method for producing the solidelectric capacitor according to the present invention will be describedstep by step below in detail with reference to the accompanyingdrawings.

In the present invention, multiple anode bodies composed of aplate-shaped valve acting metal having micropores are directly piled andintegrated with a solid electrolyte, and a conductive layer is stackedon the solid electrolyte to form a solid electrolytic capacitor element.The term “directly” herein used in the phrase “directly piled” meanspiling without interposing other layers such as a solid electrolytelayer and a conductive layer on the surface of the valve acting metal.

[Anode Body]

The valve acting metal which can be used as an anode body in the presentinvention is selected from aluminum, tantalum, niobium, titanium,zirconium, and alloys thereof. Preferably, the valve acting metal isaluminum or an alloy thereof. As a specific form of the valve actingmetal material, a plate-shaped metal material such as foil is preferred.These valve acting metals with micropores formed at their surfaces byetching or the like in advance in accordance with a known method arepreferably used.

FIG. 1 is a schematic view illustrating a cross section in which aplate-shaped valve acting metal having micropores (hereinafter,abbreviated as a valve acting metal foil) for constituting an example ofa solid electrolytic capacitor element according to the presentinvention is used as an anode body, and joined by welding or the like ata central joint (4) of the cathode section. Two sheets of valve actingmetal foil with a dielectric film (2) formed on their surfaces arejoined with each other in such a way that the shorter valve acting metalfoil (1 a) has a central section joined at the joint (4) with the longervalve acting metal foil (1 b). In addition, FIG. 1 shows an etchinglayer (3) of the valve acting metal foil, an insulating resin (5 a) inthe etching layer, and an insulating resin layer (5 b) formed on thesurface of the valve acting metal foil.

While the number of anode bodies integrated with a solid electrolytealso depends on the thickness and material of the valve acting metalfoil, and is thus not able to be specified categorically, it is possibleto pile anode bodies one on top of another in the range of two to tensheets.

In the present invention, the valve acting metal foil is used which hasbeen cut into a size in line with the shape of a product. While thethickness of the foil varies depending on the intended use, foil with athickness of about 50 to 500 μm is typically used. While the size andshape of the foil also varies depending on the application, rectangularmetal foil is preferable as a plate-shaped element unit, which is about1 to 50 mm in width and about 1 to 50 mm in length, more preferablyabout 2 to 20 mm in width and about 2 to 20 mm in length, even morepreferably about 2 to 5 mm in width and about 2 to 6 mm in length.

In the present invention, multiple anode bodies composed of aplate-shaped valve acting metal having pores are piled one on top ofanother, and at least adjacent anode bodies are joined at a sectionthereof, that is, at least one point or multiple points of the adjacentanode bodies. The joint is preferably an anode body section covered withno solid electrolyte or insulating resin (anode section), or a sectioncovered with a solid electrolyte for forming a cathode (cathodesection), which is separated from the anode section by a separatorcomposed of an insulating resin, in particular a central section of asection to serve as a cathode section for piled anode bodies. Inaddition, in the case of joining at multiple points of the valve actingmetal foil, the multiple sheets of the valve acting metal foil arepreferably joined in position by an equal force. In particular, in thecase of joining by welding, aluminum is molten to provide an integratedjoint, thus resulting in collapse of the etching layer. Therefore, thejoint will lose the original surface area and lose the originallydeveloped capacitance. Accordingly, it is more preferable to reduce thejoint region.

The joint region, that is, the area of the joint is preferably 1 to 30%of the area of the cathode section of the piled valve acting metal foil,and especially preferably 5 to 20%. When the area of the joint is lessthan 1% of the area of the cathode section of the piled valve actingmetal foil, it is difficult to stably fix adjacent anode bodies, andpeeling may be caused in the process of forming the solid electrolyte.On the other hand, when the area of the joint exceeds 30%, thecapacitance is decreased, and the number of piled sheets of the valveacting metal foil will thus have to be increased in order to recover themissing capacitance.

The welding for the anode bodies is preferably welding which is capableof both electrical connection and physical fixation between the sheetsof the valve acting metal foil at the same time. The welding can becarried out, for example, by any one of resistance welding, laserwelding, and ultrasonic welding, or by the combined use of thesemethods.

[Insulating Resin]

In order to separate the section covered with no solid electrolyte orinsulating resin (anode section) from the section covered with a solidelectrolyte for forming a cathode (cathode section), an insulating resinis applied to a boundary zone between the sections.

As the insulating resin, general heat resistant resins, preferably, heatresistant resins or precursors thereof which are soluble or swellable ina solvent, compositions composed of inorganic fine powder and acellulose based resin, etc., can be used. However, the material of theinsulating resin is not limited. Specific examples of the insulatingresin include polyphenylsulphone (PPS), polyethersulphone (PES), acyanate ester resin, fluorine resins (tetrafluoroethylene,tetrafluoroethylene-perfluoroalkyl vinyl ether copolymers, etc.), lowmolecular weight polyimides and derivatives thereof, and precursorsthereof, and in particular, low molecular weight polyimides,polyethersulphone, fluorine resins, and precursors thereof arepreferable.

FIGS. 1 to 4 shows as examples anode bodies with an insulating resin (5)applied. In each of FIGS. 1 to 4, the left side from the insulatingresin (5) serves as an anode section, whereas the right side from theinsulating resin (5) serves as a cathode section. In FIG. 1, a longervalve acting metal foil (1 b) has a section overlapped with no foil ofthe valve acting metal foil, and the insulating resin (5) is applied tothe section. In FIG. 2, the insulating resin (5) shown as an example inFIG. 1 is applied to cover the tip section of a shorter valve actingmetal foil (1 a) and at the same time, cover a left intermediate sectionof the longer valve acting metal foil (1 b), thereby mutually fixing theboth sheets of the foil. In FIG. 3, two sheets of valve acting metalfoil which have the same length have left intermediate sections coveredwith the insulating resin, thereby mutually fixing the both sheets ofthe foil. In FIG. 4, the anode sections of the two sheets of valveacting metal foil shown as an example in FIG. 3 are joined by welding.

In the present invention, adjacent anode bodies can be mutually fixed ata section thereof with an insulating resin interposed therebetween. Morespecifically, the fixation of the sheets of the valve acting metal foilthrough the application of the insulating resin can be carried out, forexample, in accordance with a method of piling multiple sheets of valveacting metal foil with an insulating resin applied to a section for theseparation of an anode section and a cathode section of an anode bodyand solidifying or curing the insulating resin by heating for thepurpose of adhesive joining (for example, FIG. 3) or a method ofapplying an insulating resin to a section for the separation of an anodesection and a cathode section of piled sheets of valve acting metal foiland then solidifying or curing the insulating resin by heating for thepurpose of fixation (for example, FIG. 2).

In the case of fixation of the valve acting metal foil with theinsulating resin, at least adjacent sheets of valve acting metal foilare joined at a section thereof in order to provide conduction betweenmultiple sheets of valve acting metal foil. FIG. 4 shows a schematicview of an example of an anode body obtained by welding anode sectionsof two sheets of valve acting metal foil, whereas FIGS. 1 and 2 showsschematic views of examples of an anode body obtained by welding cathodesections of two sheets of valve acting metal foil.

[Dielectric Oxide Film]

If necessary, a dielectric oxide film is subsequently formed on thesurface of the anode body. The method for forming the dielectric oxidefilm on the surface of the anode body is not particularly limited, andknown methods can be used as the method. For example, in the case ofusing aluminum foil, anodization can be carried out in an aqueoussolution containing a boric acid, a phosphoric acid, an adipic acid, ora sodium salt or an ammonium salt thereof to form an oxide film. Inaddition, in the case of using a sintered body of powder such astantalum, anodization can be carried out in an aqueous phosphoric acidsolution to form an oxide film on the sintered body.

The conditions for chemical conversion such as the chemical conversionsolution and chemical conversion voltage for use in chemical conversioncan be experimentally confirmed in advance and set to appropriatevalues, depending on the capacitance, withstand voltage, etc., requiredfor a solid electrolytic capacitor to be produced. It is to be notedthat the valve acting metal material is subjected to surface roughening(made more porous), then subjected to a chemical conversion treatment,comes onto the market as a chemically concerted substrate with adielectric oxide film formed, and used for solid electric capacitors,etc. In the present invention, such commercially available valve actingmetal foil subjected to a chemical conversion treatment can be alsoused. However, for example, in the case of joining a portion of thecathode section by welding, the dielectric layer subjected to thewelding may be collapsed. In such a case, it is necessary to form adielectric oxide film again by chemical conversion or the like.

[Solid Electrolyte]

Then, a solid electrolyte layer is formed on the cathode section byimpregnating the surfaces of directly piled anode bodies and the spacebetween the anode bodies with a raw material solution to be polymerizedto yield a conductive polymer and polymerizing the raw materialsolution, thereby allowing for the step of covering the multiple anodebodies with the solid electrolyte to integrate the anode bodies. For theintegration of multiple anode bodies, methods for fixing anode bodies,such as welding and bonding with an insulating resin, may be used incombination.

In the present invention, a conductive polymer is preferable as thesolid electrolyte formed on the cathode section.

While examples of the conductive polymer include a conductive polymerincluding as a repeating unit a structure represented by a compoundhaving a thiophene skeleton, a compound having a polycyclic sulfideskeleton, a compound having a pyrrole skeleton, a compound having afuran skeleton, a compound having an aniline skeleton, or the like, theconductive polymer for forming the solid electrolyte is not to beconsidered limited to the example.

The solid electrolyte (6) is formed in the etching layer of the valveacting metal foil (6 a) and on the surface of the valve acting metalfoil (6 b). In FIG. 5 or FIG. 6, the solid electrolyte is formed notonly on the outer circumference of two piled sheets of valve actingmetal foil, but also in the etching layer inside the piled sheets,thereby the anode bodies integrated. In addition, FIG. 5 shows a carbonpaste (7) and a conductive paste (8).

According to the present invention, as described above, the step ofintegrating multiple anode bodies with the use of a solid electrolytecan be carried out after carrying out the step of joining the anodebodies. In addition, in the case of joining anode bodies only at theanode section, the anode bodies may be joined at the anode section afterintegrating the anode bodies with the use of a solid electrolyte, ratherthan joining (for example, FIG. 4).

While the gap between piled sheets of valve acting metal foil may beinevitably generated, structures with the gap reduced as much aspossible are preferable because the capacitance per volume can beincreased.

[Solid Electrolytic Capacitor]

Furthermore, a carbon paste layer and a silver paste layer are providedon the surface of the solid electrolyte layer covering the entirecathode section of the integrated anode bodies to form a cathode sectionfor a capacitor, thereby providing a capacitor element.

A solid electrolytic capacitor according to the present invention can beobtained by connecting an anode lead terminal to the anode section ofthe capacitor element, connecting a cathode lead terminal to the cathodesection thereof, and further subjecting the entire element to sealingwith an insulating resin such as an epoxy resin.

The thus obtained capacitor element according to the present inventionmay be used in a stack. For example, a stack-type solid electrolyticcapacitor can be formed by stacking the capacitor element on the leadterminal.

EXAMPLES

Typical examples of the present invention will be given and specificallydescribed below. It is to be noted that these examples are given only asexplanatory exemplification, and the present invention is not to beconsidered limited to these examples in any way.

Example 1 Production of Solid Electrolytic Capacitor of Two Anode BodiesPiled According to Embodiment in FIG. 5

Chemically converted aluminum foil (3V chemical product) with athickness of 110 μm was cut into a foil piece with a width of 3.5 mm,and the foil piece was cut into foil pieces with a length of 13 mm. Oneshorter side of this foil piece was fixed to a metallic guide bywelding. Subsequently, the chemically converted aluminum foil cut intothe width of 3.5 mm was cut into a foil piece with a length of 4.5 mm,the foil piece was placed on the upper surface of the other chemicallyconverted aluminum welded to the metallic guide, and a central section(cathode central section) of the chemically converted foil with thelength of 4.5 mm was subjected to resistance welding while the tipsunfixed to the guide were aligned and overlapped. The resistance weldingwas carried out with the use of a rectangular electrode of 1 mm×2 mm. Itis to be noted that the area with its initial capacitance missed due tothe welding accounted for 12%.

Next, a masking material (polyimide resin) for the separation of ananode section and a cathode section was applied in a linear shape with awidth of 0.8 mm, mainly to a section at 5 mm from the tips of thealuminum foil pieces unfixed to the guide, and dried at 180° C. for 1hour. Then, the section from the tips of the aluminum foil piecesunfixed to the guide to the applied polyimide resin was subjected to achemical conversion treatment (at a current density 5 mA/cm², a chemicalconversion voltage of 3.5 V, and a temperature of 65° C. in an aqueoussolution of 9 mass % ammonium adipate for 10 minutes), washing withwater, and drying. For a solid electrolyte to serve as a cathode layer,the cathode section (3.5 mm×4.6 mm) was immersed in an isopropanolsolution containing 3,4-ethylenedioxythiophene (solution 1), and pulledup and left as it was. Next, the cathode section was immersed in anaqueous solution containing ammonium persulfate (solution 2), dried, andsubjected to oxidative polymerization. The operation from the immersioninto the solution 1, then through the immersion into the solution 2, tothe oxidative polymerization was repeated 20 times. Next, the cathodesection was washed with warm water at 50° C., and then dried at 100° C.,thereby forming a solid electrolyte layer. Furthermore, an electrode wasformed on the cathode section with the use of a carbon paste and asilver paste, thereby completing a capacitor element with its crosssection shown in FIG. 5.

The cathode section was joined onto a lead frame with a silver paste, ananode lead terminal was joined by welding onto the section with no solidelectrolyte formed, the entire element was subjected to sealing with anepoxy resin, and a voltage of 2 V was applied at 135° C. for aging,thereby producing 10 pieces in total of chip-type solid electrolyticcapacitors. For these 10 capacitors, the capacitance at 120 Hz and theequivalent series resistance (ESR) at 100 kHz were measured as initialcharacteristics, and the average values for the capacitance andequivalent series resistance are shown in Table 1. In addition, theaverage thickness (element thickness) and ratio of capacitance developed(capacitance/capacitor element thickness) for the capacitor elements areshown together in Table 1.

Example 2 Production of Solid Electrolytic Capacitor of Two Anode BodiesPiled According to Embodiment in FIG. 6

Chemically converted aluminum foil (3V chemical product) with athickness of 110 μm was cut into a foil piece with a width of 3.5 mm,and the foil piece was cut into foil pieces with a length of 13 mm. Oneshorter side of this foil piece was fixed to a metallic guide bywelding. In order to chemically convert the cut end, a polyimide resinsolution (produced by Ube Industries, Ltd.) was painted in a linearshape with a width of 0.8 mm onto a point at 7 mm from the tip unfixedto the guide, and dried at about 180° C. for 30 minutes. The sectionfrom the tip of the aluminum foil piece unfixed to the guide to theapplied polyimide resin was subjected to a chemical conversion treatmentin the same way as in Example 1, and subjected to washing with water anddrying. Next, a polyimide resin for the separation of an anode sectionand a cathode section was applied in a linear shape with a width of 0.8mm, mainly onto a section at 5 mm from the tip of the aluminum foilpiece for one surface. The dryish surfaces of the chemically convertedaluminum foil pieces with the polyimide resin applied thereto weresubjected to pressure bonding and still standing for 30 minutes, andthen drying at about 180° C. for 30 minutes. Again, the polyimide resinwas painted in a linear shape with a width of 0.8 mm for one side, ontoboth of the outer surfaces of the piled pieces, mainly onto a section at5 mm from the tips of the aluminum foil pieces, and dried at about 180°C. for 30 minutes. The piled foil pieces were processed in the same wayas in Example 1 after the application of the polyimide resin, therebyproducing a capacitor element with the two sheets of chemicallyconverted foil piled and with its cross section shown in FIG. 6.

Subsequently, 10 pieces in total of chip-type solid electrolyticcapacitors with their cross sections shown in FIG. 6 were produced inthe same way as in Example 1, except that the sections of the two sheetsof chemically converted aluminum foil with no solid electrolyte formedwere welded onto an anode lead terminal at the same time for conductivejoining, and the chip-type solid electrolytic capacitors were evaluated.The average thickness (element thickness) for the capacitor elements,the initial characteristics, and the ratio of capacitance developed perelement thickness for the capacitor elements are shown in Table 1.

Example 3 Production of Solid Electrolytic Capacitor of Three AnodeBodies Piled

Chemically converted aluminum foil (3V chemical product) with athickness of 110 μm was cut into a foil piece with a width of 3.5 mm,and the foil piece was cut into foil pieces with a length of 13 mm. Oneshorter side of this foil piece was fixed to a metallic guide bywelding. Chemically converted aluminum foil (3V chemical product) with athickness of 110 μm was cut into a foil piece with a width of 4.5 mm,and the foil piece was cut into foil pieces with a length of 7 mm. Thefoil piece with the length of 7 mm was folded at its central section,and aligned and overlapped with the tip of the chemically convertedaluminum foil piece with the length of 13 mm, which was unfixed to theguide, and the central section was subjected to resistance welding forintegration.

Next, a polyimide resin for the separation of an anode section and acathode section was applied in a linear shape with a width of 0.8 mm,mainly to a section at 5 mm from the tip of the aluminum foil pieceunfixed to the guide, and dried at 180° C. for 1 hour. In order tochemically convert the cut end, a polyimide resin solution (produced byUbe Industries, Ltd.) was painted in a linear shape with a width of 0.8mm onto a point at 7 mm from the unfixed tip, and dried at about 180° C.for 30 minutes. The section from the tip of the aluminum foil pieceunfixed to the guide to the applied polyimide resin was subjected to achemical conversion treatment in the same way as in Example 1, andsubjected to washing with water and drying. The foil pieces wereprocessed in the same way as in Example 1 after the formation of a solidelectrolyte onto the cathode section (3.5 mm×4.6 mm), thereby producing10 pieces in total of chip-type capacitors, and the capacitors wereevaluated. The average thickness (element thickness) for the capacitorelements, the initial characteristics, and the ratio of capacitancedeveloped per element thickness for the capacitor elements are shown inTable 1.

Example 4 Production of Solid Electrolytic Capacitor of Two Anode BodiesPiled According to Embodiment in FIG. 7

Chemically converted aluminum foil (3V chemical product) with athickness of 110 μm was cut into a foil piece with a width of 3.5 mm,and the foil piece was cut into foil pieces with a length of 13 mm. Oneshorter side of this foil piece was fixed to a metallic guide bywelding. In order to chemically convert the cut end, a polyimide resinsolution (produced by Ube Industries, Ltd.) was painted in a linearshape with a width of 0.8 mm onto a point at 7 mm from the tip unfixedto the guide, and dried at about 180° C. for 30 minutes. The sectionfrom the tip of the aluminum foil piece unfixed to the guide to theapplied polyimide resin was subjected to a chemical conversion treatmentin the same way as in Example 1, and subjected to washing with water anddrying. Next, a polyimide resin for the separation of an anode sectionand a cathode section was applied in a linear shape with a width of 0.8mm, mainly onto a section at 5 mm from the tip of the aluminum foilpiece for one surface. The dryish surfaces of the chemically convertedaluminum foil pieces with the polyimide resin applied thereto weresubjected to pressure bonding and still standing for 30 minutes, andthen drying at about 180° C. for 30 minutes. Again, the polyimide resinwas painted in a linear shape with a width of 0.8 mm for one side, ontoboth of the outer surfaces of the piled pieces, mainly onto a section at5 mm from the tips of the aluminum foil pieces, and dried at about 180°C. for 30 minutes. Furthermore, a central section of the cathode wassubjected to resistance welding with the use of a rectangular electrodeof 1 mm×2 mm. The piled foil pieces were processed in the same way as inExample 1 after the application of the polyimide resin, therebyproducing a capacitor element with its cross section shown in FIG. 7.

Subsequently, 10 pieces in total of chip-type solid electrolyticcapacitors were produced in the same way as in Example 1, except thatthe sections of the two sheets of chemically converted aluminum foilwith no solid electrolyte formed were welded onto an anode lead terminalat the same time for conductive joining, and the chip-type solidelectrolytic capacitors were evaluated. The average thickness (elementthickness) for the capacitor elements, the initial characteristics, andthe ratio of capacitance developed per element thickness for thecapacitor elements are shown in Table 1.

Comparative Example 1

Chemically converted aluminum foil (3V chemical product) with athickness of 110 μm was cut into a foil piece with a width of 3.5 mm,and the foil piece was cut into foil pieces with a length of 13 mm. Oneshorter side of this foil piece was fixed to a metallic guide bywelding. In order to chemically convert the cut end, a polyimide resinsolution (produced by Ube Industries, Ltd.) was painted in a linearshape with a width of 0.8 mm onto a point at 7 mm from the tip unfixedto the guide, and dried at about 180° C. for 30 minutes. The sectionfrom the tip of the aluminum foil piece unfixed to the guide to theapplied polyimide resin was subjected to a chemical conversiontreatment, and subjected to washing with water and drying. Next, apolyimide resin for the separation of an anode section and a cathodesection was applied in a linear shape with a width of 0.8 mm, mainlyonto a section at 5 mm from the tip of the aluminum foil piece, anddried at 180° C. for 1 hour. The foil piece was processed in the sameway as in Example 1 after the formation of a solid electrolyte onto thecathode section (3.5 mm×4.6 mm), thereby producing 10 pieces in total ofchip-type capacitors, and the capacitors were evaluated. The averagethickness (element thickness) for the capacitor elements, the initialcharacteristics, and the ratio of capacitance developed per elementthickness for the capacitor elements are shown in Table 1.

TABLE 1 Ratio of Capacitance Element Developed Characteristics InitialCapacitance/ Element Characteristics Element Example ThicknessCapacitance ESR Thickness Item (μm) (μF) (mΩ) (μF/μm) Example 1 263 7919.8 0.30 Example 2 279 90 15.4 0.32 Example 3 373 117 18.1 0.32 Example4 275 88 13.6 0.32 Comparative 196 48 18.3 0.24 Example 1

As shown in Table 1, the capacitor elements (Examples 1 to 4) accordingto the present invention has ESR hardly degraded and allows the ratio ofcapacitance developed per element thickness to be increased, as comparedwith the conventional element (Comparative Example 1).

The present invention is intended to provide an economical solidelectrolytic capacitor element which has a high ratio of capacitancedeveloped per unit volume, and a method for producing the electrolyticcapacitor element. The solid electrolytic capacitor element according tothe present invention allows for the production of a solid electrolyticcapacitor which has the same capacitance, a lower profile, and a smallerarea.

What is claimed is:
 1. A solid electrolytic capacitor elementcomprising: an anode body including a valve acting metal having a pore;a dielectric layer formed on a surface of the anode body; and a solidelectrolyte layer on the dielectric layer, wherein the anode bodycomprises multiple plate-shaped anode bodies directly piled andintegrated with the solid electrolyte, wherein adjacent piled anodebodies are joined at a first section thereof, wherein the first sectionis a weld, and wherein adjacent anode bodies are mutually fixed at asecond section thereof with an insulating resin interposed therebetween.2. The solid electrolytic capacitor element according to claim 1,wherein the first section is not covered with the solid electrolyte. 3.The solid electrolytic capacitor element according to claim 1, whereinthe first section is at a cathode section which is covered with thesolid electrolyte.
 4. The solid electrolytic capacitor element accordingto claim 3, wherein an area of joining of the first section is 1 to 30%of the area of the cathode section of the piled anode bodies.
 5. Thesolid electrolytic capacitor element according to claim 1, wherein theanode body has a thickness of 50 to 500 μm.
 6. The solid electrolyticcapacitor element according to claim 1, wherein the valve acting metalis aluminum, tantalum, niobium, titanium, zirconium, and alloys thereof.7. The solid electrolytic capacitor element according to claim 1,wherein the solid electrolyte is a conductive polymer.
 8. A solidelectrolytic capacitor comprising: the solid electrolytic capacitorelement according to claim 1; an anode lead terminal and a cathode leadterminal respectively connected to an anode section and a cathodesection of the solid electrolytic capacitor element; and a resin sealingthe solid electrolytic capacitor element.
 9. The solid electrolyticcapacitor according to claim 8, wherein a plurality of solidelectrolytic capacitor elements are stacked.
 10. A method for producinga solid electrolytic capacitor, the method comprising: connecting ananode lead terminal and a cathode lead terminal respectively to an anodesection and a cathode section of the solid electrolytic capacitorelement according to claim 1; and sealing the solid electrolyticcapacitor element with a resin.
 11. A method for producing a stack-typesolid electrolytic capacitor, the method comprising: stacking aplurality of the solid electrolytic capacitor elements according toclaim 1; connecting an anode lead terminal and a cathode lead terminalrespectively to an anode section and a cathode section of the stack, andsealing the stack of solid electrolytic capacitor elements with a resin.12. The solid electrolytic capacitor element according to claim 1,wherein the anode body is a metallic foil.